Jan 08, 2013– London, UK (Techreleased) –Telit Wireless Solutions, a leading global vendor of high-quality machine-to-machine (M2M) modules and value-added services, today announced the introduction of the UE910 V2 HSDPA and HE910 V2 HSPA+ modules based on Qualcomm Technologies, Inc. chipsets, each to be banded for European and North American markets. Both products feature dual-band 3G and GSM/GPRS/EDGE support. The entry-level 3G UE910 V2 is based on Qualcomm Technologies’ QSC6270 chipset and delivers a top 3.6Mbps downlink data rate. The HE910 V2 is based on Qualcomm Technologies’ MDM6200 chipset and delivers up to 14.4Mbps downlink and 5.76Mbps uplink data rates. The new products are fully compatible with Telit’s xE910 family and can be easily dropped into existing or planned designs for xE910 modules requiring no additional rework. Positioned at entry-level and mid-range respectively, the new Qualcomm Technologies-based UE910 V2 and HE910 V2 modules enable the Telit xE910 family to enhance cross-technology compatibility with its other popular global air-interface technologies. The application of the Qualcomm Technologies chipsets improves interchangeability between CDMA (1xRTT, EV-DO) and UMTS (HSDPA, HSPA+) variants making the adaptation of customer applications to regional technical requirements quick and easy, minimizing time to market and total cost of ownership.
The QSC6270-based UE910 V2 is to be positioned as a 2G to 3G migration path product, and includes high-value features such as analog audio, making it ideal for applications from home and commercial security and surveillance systems, to asset monitoring, logistics, and mass-transit monitors. Telit is planning a UE910 V2 variant based on QSC6270-Turbo with additional support for Java J2ME 3.2 and eCall.
The MDM6200-based HE910 V2 is fully digital audio capable, supports both GPS and GLONASS location technologies, and provides full-duplex PCM input and output. These features combined with the up to 14.4Mpbs downlink and 5.76Mbps uplink data rates make the product ideal for applications such as a video surveillance and security, and other emerging applications areas such as healthcare, Smart Home, and Smart Grid.
Both the UE910 V2 and HE910 V2 will be available in local band-group variants as required for all major carriers and partner networks in North America and Europe. The Qualcomm Technologies-based products will be available in North America with 850/1900MHz and in Europe with 900/2100MHz dual-band combinations. Both regional variants will be available in data-only as well as data & voice variants.
“The Qualcomm Technologies-based entry-level 3G UE910 V2 and mid-range HE910 V2 are Telit’s new 3G products launched in response to increasing demand for dual-band HSDPA, and HSPA+ modules,” said Dominikus Hierl, chief marketing officer at Telit Wireless Solutions. “They come to address the need from application areas and regions requiring easy interchangeability between CDMA or UMTS lines of air interface technology, particularly in United States, Europe and key opportunities.”
“Qualcomm Technologies’ fully-integrated QSC6270, QSC6270-Turbo and MDM6200 chipsets support the bandwidth and feature requirements of a broad range of M2M applications, and we are pleased to enable HSDPA, and HSPA+ products in the xE910 family,” said Nakul Duggal, vice president of product management for IOE, Qualcomm Technologies. “By using Qualcomm Technologies’ Gobi 3G solutions in its xE910 product family, Telit will be able to offer its customers the technology flexibility to address M2M products and drive 2G to 3G migration in Europe and North America.”
As the industry’s only pure-play m2m company, Telit creates value by partnering with customers to provide expert guidance and support from concept development through manufacturing, quickly bringing ideas to market in all application areas including the new “smart” space. With service enhanced products in cellular, short-range, and satellite-navigation easily bundled through high-level software interfaces, Telit-powered m2m devices cost less to integrate, maintain, operate, and update with lower price points for bundled products and savings translating into competitive advantage at the time of sale and throughout the operating life of the customer device.