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Mitsubishi Electric’s New 6.5 kV Full-SiC Power Semiconductor Module Achieves World’s Highest Power Density

Mitsubishi Electric’s New 6.5 kV Full-SiC Power Semiconductor Module Achieves World’s Highest Power Density


Mitsubishi Electric’s New 6.5 kV Full-SiC Power Semiconductor Module Achieves World’s Highest Power Density  – Jan 31, 2018 – Tokyo, Japan (Techreleased) – Mitsubishi Electric Corporation announced today that it has developed a 6.5 kV full silicon carbide (SiC) power semiconductor module that is believed to offer the world’s highest power density (calculated from rated voltage and current) among […]

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Posted On January 31, 2018
power semiconductor module

Mitsubishi Electric’s New 6.5 kV Full-SiC Power Semiconductor Module Achieves World’s Highest Power Density  – Jan 31, 2018 – Tokyo, Japan (Techreleased) – Mitsubishi Electric Corporation announced today that it has developed a 6.5 kV full silicon carbide (SiC) power semiconductor module that is believed to offer the world’s highest power density (calculated from rated voltage and current) among power semiconductor modules rated from 1.7 kV to 6.5 kV.

power semiconductor module

The unprecedented power density is made possible by the model’s original structure with integrated metal-oxide-semiconductor field-effect transistor (MOSFET) and diode on single chip and its newly developed package.

Mitsubishi Electric expects the module to lead to smaller and more energy-efficient power equipment for high-voltage railcars and electric power systems. Going forward, the company will continue to further develop the technology and conduct further reliability tests.

6.5 kV rated voltage is highest among silicon insulated-gate bipolar transistor (IGBT) power semiconductor modules

Full-SiC technology improves power density and efficiency and enables higher operating frequencies for smaller and more energy-efficient high-voltage power electronics equipment

Chip area reduced drastically thanks to integrating MOSFET and diode on single chip

Insulating substrate with superior thermal properties and reliable die bonding technology facilitate heat dissipation and heat tolerance

9.3 kVA/cm3 power density is world’s highest among power semiconductor modules rated from 1.7 kV to 6.5 kV

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