Feb 18, 2013– Tokyo, Japan (Techreleased) – Mitsubishi Electric Corporation announced today it will launch a transfer-mold-type, super-mini dual inline package intelligent power module (DIPIPM) primarily used for inverter drive systems of small-capacity motors in refrigerators and other consumer appliances. The module uses a metal oxide semiconductor field effect transistor (MOSFET) switching device featuring low power-on voltage in low current regions. Sales will begin on March 1.
With optimized low-loss-drive ICs and a high-heat dissipation design, the module will help to reduce power consumption, advance miniaturization and lower the cost of inverter systems for small-capacity motor drive applications.
|Reduced power consumption in small-capacity inverter systems
|High reliability through high-heat dissipation structure
|Cost reduction and miniaturization of final product
|PSM03S93E5/-A/-C||3A/500V||March 1, 2013|
|Dimensions||24 x 38 x 3.5 mm (same as super-mini DIPIPM)|
|Built-in Chips||MOSFET x 6 forming a three-phase bridge,
HVIC x 1, LVIC x 1and Bootstrap Diode x 3
|Functions||Protection against short circuits, control power-supply undervoltage and
over-heating (LVIC monitoring ); and error output
|Others||Divided-source-type N-side MOSFET|
In 1997, Mitsubishi Electric first commercialized its DIPIPM transfer-mold-type intelligent power module, which has contributed greatly to miniaturization and energy-savings in inverter systems. The technology has gained increased importance because annual power consumption has become an important index of energy-saving performance in consumer appliances, such as refrigerators. Needs are increasing for reducing loss in rated power, and also in low current regions where a high percentage of power use is concentrated.
DIPIPM is a registered trademark of Mitsubishi Electric.